Patent attorney

Overview

Yoshiaki Ito

Last educational background

TOKYO INSTITUTE OF TECHNOLOGY
Master's course of Management engineering

Handling Field

electric, foreign filings for domestic clients, etc
(38years of experience from 1980)

Shintaro Arai

Last educational background

TOKYO UNIVERSITY OF SCIENCE
Faculty of Engineering Division Ⅱ, Department of Electrical Engineering

Qualification

Software Design & Development Engineer

Handling Field

software, network technology,electric apparatus, etc
(14years of experience from 2004)

Takashi Aoki

Last educational background

CHIBA INFORMATION ACCOUNTING COLLAGE
Department of Information Processing

Handling Field

software, network technology, audio and video equipment, business model, etc
(14years of experience from 2004)

Takayuki Hirano

Last educational background

TOKYO INSTITUTE OF TECHNOLOGY
Master's course of Energy science

Handling Field

network technology, image processing, business model, semiconductor device, etc
(14years of experience from 2004)

Tsuyoshi Hayashi

Last educational background

TOKYO UNIVERSITY OF SCIENCE
Department of Pure and Applied Chemistry

Handling Field

inorganic chemistry, electrochemistry, organic chemistry, amusement apparatus, etc
(11years of experience from 2007)

Yoshiyasu Tomizawa

Last educational background

TOKYO DENKI UNIVERSITY
Department of Electrical and Electronic systems Engineering

Handling Field

mechanical, etc
(11years of experience from 2007)

Koji Mikawa

Last educational background

NATIONAL DEFENSE ACADEMY OF JAPAN
Master's cource of Electronic Engineering

Handling Field

electric, electronic, network technology, optical disk, image processing, acoustic and video equipment, etc
(25years of experience from 1993)

Hirotaka Tsuchiya

Last educational background

TOKYO INSTITUTE OF TECHNOLOGY
Master's course

Handling Field

Packaging materials such as films, plastic moldings and liquid paper containers.
Film processing technology and processed products (industrial materials) such as coating, lamination and vapor deposition.
Method and apparatus for aseptic filling packaging.

(2years of experience from 2016)